4562 IT & Software Developer jobs in the US
IC package engineer (Starlink, Akoustis)
$221,000 - 261,000
SpaceX
Fm 1209 858, Bastrop
$221,000 - 261,000
Requirements
Must:
- Bachelors degree in Mechanical Engineering, Packaging Engineering, Materials Science, Electrical Engineering, or related engineering field
- 1+ year of experience in designing, qualifying, or implementing IC packaging solutions (including internships and academic projects)
- 2+ years of hands-on experience with semiconductor packaging technologies, such as Flip-chip, Wire bond, WLP, LGA, CSP, QFN (preferred)
- Solid understanding of packaging materials and their thermal, mechanical, and electrical properties
- Experience with thermal management techniques for power-dense electronics
- Familiarity with reliability testing standards (JEDEC, IPC) including thermal cycling, uHAST, HTS, and vibration (preferred)
- Knowledge of assembly processes like SMT, die attach, reflow soldering, encapsulation, and underfill
- Strong analytical capabilities, particularly in Root Cause Analysis, Statistical Process Control (SPC), Six Sigma/Lean tools, and Failure Mode and Effects Analysis (FMEA)
- Proficient in EDA/CAD tools, especially AutoCAD; experience with ANSYS or COMSOL is a plus
- Excellent project management and organizational skills with strong communication abilities
- Willingness to work extended hours and weekends to achieve critical milestones
- Ability to travel up to 20% for supplier and manufacturing support
- Capacity to perform light physical tasks, including lifting up to 25 lbs and handling packaging samples
Responsibilities
- Design, develop, and qualify advanced IC packaging technologies, including Flip-chip, Wire bonding, Wafer-Level Packaging (WLP), QFN, CSP, and LGA
- Select and evaluate packaging materials based on their thermal, mechanical, and electrical characteristics
- Implement thermal management strategies, including simulation and heat dissipation techniques
- Define and execute reliability test plans for package design qualifications, such as thermal cycling, uHAST, and HTOL
- Utilize EDA/CAD tools for mechanical layout with a preference for experience in ANSYS or similar simulation tools
- Apply Design for Manufacturability (DFM) methodologies to ensure optimized manufacturability and reliability from concept to production
- Provide expert technical guidance for IC assembly and packaging processes, including SMT, die attachment, reflow, wire bonding, underfill, and encapsulation
- Conduct failure analysis investigations using tools like X-ray, SEM, FIB, and cross-sectioning to identify and resolve issues
- Perform root cause analysis and troubleshoot data-driven issues using tools such as FMEA, SPC, and Six Sigma methodologies
- Collaborate with PCB and substrate design teams to ensure compatibility and integration of package and board designs
- Manage project timelines, risks, and deliverables related to packaging initiatives, providing regular updates to key stakeholders
Description
At SpaceX, we believe in a future where humanity explores the stars, and we are continually advancing technologies to make this vision a reality. As a wholly owned subsidiary, Akoustis contributes to this mission by providing cutting-edge RF filters using patented XBAW technology. Our purpose is to sustainably connect the world through Starlink while developing the largest constellation of satellites for a global internet network. We pride ourselves on maintaining in-house engineering and production, fostering agile decision-making and rapid delivery. Join our dynamic team to play a key role in pioneering advancements that enhance lives on Earth and beyond.
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